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Capability |
| Rigid PCB capability |
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Layer count
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1~30 layers |
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Laminates type
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FR-4,CEM-1,CEM-3,BT Resin, Teflon,PTFE,
Rogers,Aluminium, Tg130℃(150℃,170 ℃,180 ℃ 210℃), Berquist, Thermagon,Alon.Polyclad |
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Board thickness
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Min: 2-Layer: 0.2 mm -6.0 mm 4-Layer: 0.40mm -8.0mm
6-Layer: 0.8 mm -8.0 mm 8-Layer: 1.0 mm -8.0mm
10-Layer: 1.2 mm -8.0 mm 12-Layer: 1.5 mm -8.0mm
Max: 8mm (0.3150")
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Base copper thickness
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Mass production:
Min: 12um (1/3oz)
Max: 140um (4oz) for inner layer; 350um(10oz)for outer layer
Sample:
Max: 210um (6oz) for inner layer; 450um(13oz) for outer layer
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Min finished hole size
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By mechanical drilling: 0.15mm (0.006")
By laser drilling: 0.05mm (0.002") |
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Aspect ratio
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12 : 1 |
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Max panel size
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Mass production, 540mm × 740m (21.25" × 29.13")
Sample: 700mm × 1100mm (27.56" × 43.3") |
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Min line width/space
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Mass production: 3mil/3mil
Sample:
Inner layer: 0.0635mm/0.0635mm (0.0025"/0.0025")
Outer layer: 0.0585mm/0.0585mm (0.0023"/0.0023") |
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Via hole type
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Blind/Burried/Plugged |
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HDI/Microvia
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YES |
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Surface finish
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HASL / Lead Free HASL
Immersion Gold / Silver / Tin
Flash Gold. Hard Gold plating
Selective thick Gold Plating
Gold Finger (Gold thickness up to 3um)
Plating Silver (Silver through Hole,
Carbon ink, Peelable mark, OSP |
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Solder mask
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All kinds of colour
LPI, Dry Film
Min S/M pitch (LPI): 0.1mm |
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Impedance Control
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Single trace or differential controlled
50, 60, 70, 100, 110, 120, 130 ±5% |
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Min bonding pitch
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0.18mm (center to center)
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Outline finish type
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CNC Routing; V-Scoring/Cut; Punch
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Tolerances
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Min Hole registration tolerance (NPTH) ± 0.025mm
Min Hole registration tolerance (PTH) ± 0.075mm
Min Pattern registration tolerance ± 0.05mm
Min S/M registration tolerance (LPI) ± 0.075mm
Scoring Lines ± 0.15mm
Board thickness (0.1 -1.0mm ) ±15%
Board thickness (1.0 -6.35mm ) ±10%
Board Size Routed ± 0.1mm
Board Size Scored ± 0.2mm
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Electrical Testing
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Voltage 10V - 250V
Continuity 10 - 1000 Ohms
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Min annular ring
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0.025mm
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Min SMT pitch
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0.400mm (center to center)
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Technic process flow
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